Waterjet-guided laser processing, Proceedings of SPIE | 10 ...
The waterjet-guided laser processing is a thermal cutting process in which the laser beam is used as the machine tool for cutting and the fine waterjet plays a role as an optical waveguide. The laser beam is guided in the waterjet stream with the full reflection that takes place at the boundary between water and air, in a manner similar to glass fibers. The waterjet also has the function of ...
Laser machines for cutting edge processing | Drupal
Laser machines for cutting edge processing - Indiamond Laser machines for cutting edge processing ( ) Alphabet A-Z Alphabet Z-A Date (newest first) Date (oldest first)
Semiconductor dicing systems with water jet guided laser ...
Synova's new 300 mm (12") wafer dicing system integrates a maintenance free fiber laser. Details page LDGS 300 A The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers.
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Synova Lgs Laser Edge Grinding Machines
Synova Lgs Laser Edge Grinding Machines . Water jet guided laser cutting technology Synova. The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers.
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Laser Cutting System Laser machining of diamond tools
The Synova LCS 50-5 laser cutting system (working area: 50 x 50 x 50 mm) can cut extremely hard materials with highest precision. It is a compact machine with 5-axis capability with a user-friendly interface and intuitive CAM software for batch processing of PCD and MCD tools.
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LoDolce Machine Company, Inc. state-of-the-art full CNC machining, metal fabricating, and wet/powder coating facility, a professional source for contract manufacturing since 1960, ISO 9001 certified, quick competitive quoting, highest quality services in the Northeast. Providing services to New York, New Jersey, Connecticut and Pennsylvania.
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Synova · Lgs Laser Edge Grinding Machines. synova lgs laser edge grinding machinesGrinding The LCS 50 is Synova s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is designed for machining industrial diamond tools and other small work pieces that require precision cutting drill- ling grooving or slicing.
Profile Grinding Small Profiles
Profile Grinding Small Profiles. The grinding of long sections of curved and tangent straight track on a tonnage or time based frequency.2.2 spot grinding and switch and crossing grinding the grinding of short sections of track such as switches turnouts, crossings, areas with obstructions and small lengths of track using smaller grinding machines based on tonnage or time.
General Specifications LCS 50 - 3 LCS 50 - 5
3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, engraving The LCS 50 is Synova's most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is
Synova - LCS 50 - Metal Cutting Systems - Laser Cutting ...
The LCS 50 with 3 or 5 axes is Synova's most compact and cost-efficient Laser MicroJet ® machine. The LCS 50 is ideal for finish-machining of diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing. The machine uses linear motor axes (LCS 50-3) and ...
inetis - Synova SA
First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993
Company - Synova SA
First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993
SYNOVA S.A. | Drupal
Grinding machines for shank tools; Grinding wheel electroplated; ... Synova S.A., headquartered in Duillier, Switzerland, manufactures advanced laser cutting systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet) in a true industrial CNC platform. ... Laser machines for cutting edge processing. Get online ...
Cutting diamond tools using the Laser MicroJet® technology ...
Cutting diamond tools using the Laser MicroJet® technology on a 5-axis machine A. Richmann, S. Kurzen, B. Carron, B. Richerzhagen Synova SA, Chemin de la Dent d'Oche, 1024 Ecublens, Switzerland Abstract The Laser MicroJet® technology uses a water coupled ns-laser to cut various materials e.g. diamond, semiconductors, ceramics and metals.
SYNOVA Announces Grand Opening of New U.S. Headquarters
SYNOVA Announces Grand Opening of New U.S. Headquarters Tahoma Engineered Solutions Completes ISO 90012015 Recertification TCI Precision Metals Installs Additional Waterjet Machining Center
Synova: Your supplier of water jet guided laser cutting ...
First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993
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The micro-machining evaluation of non-metallic materials ...
The field of laser machining is extremely diverse, and virtually all commercially available high power lasers have applications for which they are particularly suited [].Termed the Laser-Microjet® or LMJ by its developers Synova SA, this hybrid technology combines a high power laser and a low pressure water jet.
Precision cutting and grooving with the Laser MicroJet
Synova SA, Switzerland Precision cutting and grooving with the Laser MicroJet ... EPMT 2010 3 Founded: 1997 Headcount: 60 employees Company. EPMT 2010 4 Products Laser Dicing System (LDS) Laser Grinding System (LGS) Hybrid Laser Saw (HLS) w/ Disco Corp. Cutting / grooving of wafers Laser Stencil System (LSS) ... SYSTEM Machine type LCS300 ...
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Water jet guided Laser MicroJet for semiconductor ... - Synova
Synova's unique water jet guided laser systems offer many advantages for applications in the semiconductor industry compared to conventional diamond blade saws or laser systems. The "gentle" Laser MicroJet (LMJ) method enables the cutting, grooving and dicing of sensitive materials resulting in smooth edges, high wafer fracture strength ...
Water-jet-guided Laser Technology | Semiconductor Digest
The process reduces thin wafer breakage by making a cut or groove around the wafer to remove micro-cracks accumulated in the edge during back grinding. Figure 4 shows the edge of a thin silicon wafer, which was glued to a thicker support wafer with bonding tape. The top 100-μm-thick wafer was downsized using a green laser (532-nm wavelength ...
Laser Cutting System - IN DIAMOND
milling, slicing, edge grinding (K-land edges, single or multiple clearance angles), engraving, profiling The LCS 305 with integrated water jet guided laser technology (Laser MicroJet®) is specifically designed for the automatic production of large and small diamond cutting tools. The CNC machine with five synchronous axes is
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